Technology scaling to nanometer nodes causes growing increase in power density and especially leakage that in turn result in locally hot regions on the chip. In this paper, we introduce a novel methodology for temperature-aware design. The methodology embeds N-versions of the scheduler and binder such that the thermal profiles of the versions are distant from each other. Next, instead of using only one version of the scheduler and binder, a rotation of N-versions of the scheduler and binder is constructed for balancing the thermal profile of the chip. We propose a linear programming framework that takes the multiple versions as the input, and constructs the thermal-aware rotational scheduling and binding by selecting the N most efficient versions and by determining the duration of each version. Our experimental evaluation shows a very low overhead and an average 5% decrease in the steady-state peak temperature produced on the benchmark designs compared to using a schedule that balances the amount of usage of different modules.